Answer / Shagun Chahal

1. Through-hole mounting: components are mounted through holes drilled in a printed circuit board (PCB). These components have leads that pass through the PCB and are soldered on the other side. 2. Surface mount technology (SMT): components are placed directly onto the surface of the PCB, eliminating the need for through-holes. This method is more compact and allows for higher component density. 3. Mixed technology: a combination of both through-hole and SMT components on the same PCB.

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