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WHAT IS THE DIFFERNECE BETWEEN THE SEMICONDUCTOR DEVICES AND POWER SEMICONDUCTOR DEVICES?????????10 19143
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Hi i am going to attend the interview for BHEL. can you please help out in knowing about the area of preparation. I am apprearing for supervisior trainee post. Please share your views on this. Thanks (frm hydrabad)1 2120
Hi i am going to attend the interview for BHEL. can you please help out in knowing about the area of preparation. I am apprearing for supervisor trainee post. i have done diploma + B.tech. suggest answer of question that don't you think that you are overqualified for this job. thanks rahul880
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For small size, high frequency coils, the most common core material is- a. )Air b. )Ferrite c.) Powdered ion d.) Steel11 13030
. If we have a parallel plate capacitor of plate area 'A' and plate separatoin t and having a capacity C and a metallic plate r of area A and of negligible thickness is introduced in the capacitor at a distance from either of the two plates as shown in the given figure then the capacity of the capacitor will become a.) b.) C c.) 2C d.) 4C3 4535
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4. How we implement Winrunner,in our project?
current transformer balance the power level on both sides. e.g in case of step up, at secondary side voltage rise but current decrease and vice versa in case of step down transformer. but how this power level remains same in case of current transformer and voltage transformer
Kindly pls give me brief explanation about SAP SD CIN to under stand the basics & not give the entire configuration part it would be higly appreciated if some one help me at the earliest, regards, Srinu
What are the services in RMI ?
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