Where I can get the sample question for post of Junior engineer electrical-II For RRB Bhubaneswar.
I have need to pervious examinations questions and answer for RRB examination in technical, JUNIOR ENGINEER PLEASE SEND EXAMINATION QUESTION AND ANSWER MY ID k7_r@indiatimes.com
Hi Friends, I am doing engg in comp sc in the final year from the evening college, I don't have experience in technical field. I am working in nontechnical field. I have big question that will IT companies considered me as fresher or they looks experience from me ? if you reply to my query, i am really grateful to you
explain about scope and storage class in oops
how to calculate bearing pre-load?
THERE iS ANY DEFAULT CONNECTION STRING FOR WINDOWS APPLICATION IN VB.NET2005 FROM WHICH AFTER CHANGING PROJECT DIRECTORY TO OTHER PLACE AND WE DID NOT CHANGE DATABASE PATH INB SQL CONNECTION ?????
the industires choose embedded system for their applications because of reverse engg is not possible is the only reason or other reasons are available
why u have changed the university?
Hi, what is the meaning of DOCUMENTUM,how and what testers have to do with it?
Sir, In the current session I am attending the Junior Engineer Exam in Grade II for Mechanical Engineering. If it possible. Please sent the Past Exams Question on my mail. It is so useful use to me.
i am going to visa second time i was rejected on 15-07-08 and on 14-08-08 i am attending visa again with another university.so what would be the good answer if they asks that why you have changed the university?
I was once rejected for US visa in early August. But now I'm going again for interview next week. What are the chances that I will faced the same VO????
I want the details about BHEL company examination.Can anyone able to help me please.
I currently use 17-7 PH stainless which is hardened to condition CH after forming. raw matl is .1.75"X .12" X .008". Its main usage after hardening is silicon wafer retainer where it's contantly cycled up and down to putin and remove wafer after 40-60 sec process at 400C temp. At this high temperature this part seemed to deform after a a couple of hundred wafer which is what it was designed for in the first place. THere is a proposal to go to a different material to increase lifeline of this part. My question is..... can 321 SST be a plugin replacement. I know this has a higher temp rating but how about its forming characteristics, will it have spring properties, and wont become brittle after prolonged exposure to 400C.
any input on how to spec out(if possible) a larger grain structure(3/8" or larger) on a Al 6061 forging material.